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03.02.2009

Kodak Tour (Re-scheduled Due To Bad Weather)

Package Analysis and Engineering, part of Corporate Engineering and Analytical Sciences at the Eastman Kodak Company is home to a state-of-the-art testing facility for product fragility, package handling and materials characterization. The Western NY chapter of IoPP will be hosting a tour of this facility. The tour will include a walk through the 10,000 square foot facility and a discussion regarding the lab services and capabilities.

After the tour, we will be having dinner at DaVinci's on West Ridge Road in Greece.

Tour Date: Thursday, March 12th at 3pm. For more information or to register on-line please visit www.wnyiopp.org/events/kodak.html.

We hope to see you there!

Lab photo © 2009 Kodak.
All rights reserved.

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